Purpose-built infrastructure and optimized design deliver faster time-to-online and lower total cost of ownership.
Modular ARMS 200 pods enable delivery in weeks, not years, getting you to compute faster.
Redundant power, cooling and network architecture delivers Tier III uptime and resilience.
Existing and planned capacity pipeline supports long-term growth and expansion.
Purpose-built for the next generation of high-performance computing and artificial intelligence.
The deployment features DigiPower X’s modular ARMS 200 infrastructure, engineered to support NVIDIA B300 GPUs with advanced direct-to-chip liquid cooling, high-density power delivery, resilient infrastructure and modular scalability.
USDC delivers the complete infrastructure stack required for
next-generation AI deployment.
Grid-Connected Energy Assets Designed For Large-Scale AI Growth.
Direct-To-Chip Cooling And High-Speed Networking For
Dense Workloads.
NVIDIA-Ready Environments Optimized For Training And Inference.
Enterprise AI, Cloud Services, Inference Platforms
And Advanced Research.
The Global demand for data center capacity is expected to rise at an annual rate between 19% and 22% from 2023 to 2030 to reach a yearly demand of 219 Gigawatts. At USDC, we stand poised to capitalize on these secular trends by taking existing energy assets and converting them into Tier III HPC data center's at a fraction of the cost when compared to the competition.
Stay ahead of the curve with the latest developments from USDC - your trusted partner in digital infrastructure.
1-50MW+ capacity with strategic energy assets positioned for long-term AI infrastructure growth.
Deploy AI-ready
Infrastructure in weeks
Instead of years.
Direct-to-chip cooling engineered for dense AI workloads.
Built for Blackwell,
Vera Rubin and
future GPUs.
ARMS 200 provides a high-density infrastructure foundation designed to adapt to evolving accelerator architectures, enabling flexible deployment as compute platforms evolve.
Optimized for high-density AI training and large-scale inference workloads.
Purpose-built infrastructure supporting enterprise-scale AI deployment.
Future-ready architecture designed for the next generation of AI compute.
Our modular data center solution is designed to operate without evaporative cooling, eliminating the continuous water consumption associated with traditional data center cooling systems.
Using a closed-loop liquid cooling architecture, coolant is continuously recirculated through the system rather than consumed. This enables highly efficient heat removal while requiring no ongoing water consumption for cooling.
No evaporative cooling
No ongoing water consumption for cooling
Closed-loop liquid cooling
Reduced environmental impact
Greater deployment flexibility in water-constrained regions
By eliminating reliance on evaporative cooling, our modular platform delivers high-density AI and HPC cooling without placing additional demand on local water resources.
Datacenters operate at sub-millisecond precision. Our proprietary Data Center Infrastructure Management (DCIM) dashboard coordinates thermal loads, chiller configurations and server rack power levels dynamically to prevent anomalies and maximize compute density.
Live schematic tracking of chiller piping, water tank levels, heat exchanger performance and pressure/temperature sensor array telemetry. System logs monitor chiller modes and pump flow rates in real-time.
Stay ahead of the curve with the latest developments from USDC - your trusted partner in digital infrastructure.
Nvidia has taken a minority stake in Cloverleaf Infrastructure to help develop the power and site infrastructu..
A running Reuters tally of the multibillion-dollar commitments technology companies, cloud providers and inves..
Whether you need co-location, a turnkey data center build, or bare-metal
GPU compute - USDC provides the infrastructure, the scale
and the team to deliver.
